Summary
Nontechnical Description The rapid rise of generative artificial intelligence (AI) has ushered society into a new era of supercomputing-driven data exploration. This tipping point is intensifying the gap between the exploding size of AI models and the limited computing throughput available today. A major bottleneck lies in data movement, specifically, the limitations of current interconnect technologies, further constrained by the aging von Neumann architecture. To address this, this project will employ a co-designed approach spanning architecture, packaging, and device innovation to meet the
