Summary
A major challenge in designing modern semiconductor devices is removing heat they generate during routine operations. Heat accumulation reduces device performance, shortens its lifespan, and increases the energy required for cooling. This project will examine heat accumulation near “heterojunctions,” which are tiny nanometer-scale regions where different materials connect to each other. There is an extra thermal resistance at heterojunctions, which makes removing heat there especially difficult. Simulation tools are often used to analyze the motion of heat-carrying particles, but these tools
