Summary
The three-dimensional vertically integrated circuit (3D IC) has emerged as a key technology for extending the trajectory of Moore’s Law by increasing transistor density and circuit functionality through 3D chip stacking. In addition to the benefits of scaling, the 3D IC technology enables heterogeneous integration, allowing different chipsets fabricated by different semiconductor technologies to be combined for optimal performance and cost reduction. This approach holds a significant promise for the next-generation radio-frequency integrated circuits (RFICs). However, current advanced IC packa
